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Materials-Metals 2017
Page 38
November 16-17, 2017 Paris, France
13th Annual Conference on
Materials Science, Metal and Manufacturing
Journal of Materials Science and Nanotechnology
Volume 1 Issue 2
Electrodeposition of tin on copper from choline
chloride based ionic liquids
Xiangxin Xue1,2, Xiaozhou Cao1,2, Lulu Xu1,2, Xiaoyu Zhang 1,2, Qiuyue
Li1,2, Yuanyuan Shi3, He Yang 1,2 and Tao Jiang1,2
1Northeastern University, China
2Key Laboratory of Recycling Science for Metallurgical Resource, China
3Chinalco Shenyang Non-ferrous Metal Processing Co., Ltd, China
Tin and its alloys are widely used in various industrial
applications including electronics, light engineering,
automotive and building materials due to their non-
toxic, corrosion resistant and ductile properties. The
electrodeposition of Sn and Sn alloys is widely practiced in
aqueouselectrolytesincludingsulphuricacid,methanesulronic
acid, phenolsufonic acid and citric acid. However,
electrodeposition of Sn presents the low current efficiency
from aqueous solutions due to a narrow electrochemical
window of water. Ionic liquid has wide potential window,
high thermal stability, good ionic conductivity and negligible
vapor pressure as electrolyte for various electrochemical
process. The electrodeposition of Sn on copper substrate
was investigated using 0.2mol/L SnCl2∙2H2O dissolved in the
eutectic mixture of choline chloride and urea (1:2molar ratio).
A typical voltamperogram at different scan rate is shown in.
The curve displays a couple of well-define cathodic and anodic
peaks which is a typical metal deposition-stripping process.
The reduction peak potential shifts to negative potentialsi
with the increase of scan rates, which was associated with
quasi-reversible electrochemical reactions. The cathodic
peak current versus the square root of the sweep rate for the
cyclic voltammograms are shown in Figure 2. It can be seen
that the plot displays a liner relationship, indicating that the
reduction reaction was a diffusion-controlled process. The
microstructure of Sn electrodeposits at different temperatures
was analyzed by scanning electron microscopy (SEM) in
Figure 3.The results showed that the deposits are compact, and
the particles began to grow with the increase of temperature.
Figure: Cyclic voltammograms of 0.2mol/L SnCl2∙2H2O on
Mo electrode in urea-choline chloride at 343K under different
scan rates.
Recent Publications
• Anicai L, Petica A, Costovici S, Prioteasa P, Visas T
(2013) Electrodepostion of Sn and NiSn alloys coating
using choline chloride based ionic liquids-evaluation of
corrosion behavior. Electrochimica Acta 114:868-877.
• Walsh F C, Low C T J (2016) A review of developments
in the electrodeposition of tin. Surface & Coatings
Technology. 288:79-94.
• Anicai L, Costovici S, Cojocare A, Manea A, Visan T
(2015) Electrodeposition of Co and CoMo alloys coatings
using choline chloride based ionic liquids-evaluation of
corrosion behavior. Transactions of the IMF. 93(6):302-
312.
• Sakita A M P, Noce R D, Fugibara C S, Benedetti A V
(2016) On the cobalt and cobalt oxide electrodeposition
froma glyceline deep eutectic solvent. Physical Chemistry
Chemical Physics. 18(36):25048-25057.
• Maltanava H M, Vorobyova T N, Vrublevskaya O N
(2014) Electrodeposition of tin coatings from ethylene
glycol and propylene glycol electrolytes. Surface &
Coatings Technology. 254:388-397.
Biography
Xiangxin Xue received his BS, MS and PhD in 1977, 1983 and 1990 from
Institute of Metallurgy and Physical Chemistry, Ferrous Metallurgy at
Northeastern University. Since June 1998, he became a Professor and Doctoral
Tutor. In 2000, he set up the Institute of Metallurgy Resource and Environment
Engineering (now department of resource and environment) at Northeastern
University. His current research focuses on the comprehensive utilization of
metallurgy resource and green metallurgy process flow innovation.
Xiangxin Xue et al., Mater Sci Nanotechnol 2017, 1:2