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Journal of Materials Science and Nanotechnology | Volume 3

February 25-26, 2019 | Paris, France

Materials Science and Engineering

International Conference on

The study on the selective electroplating of copper foil on the semiconductor

Szu Han Chao

and

Shih Chieh Hsu

Tamkang University, Taiwan

e successfully fabricated a pre-defined patterned copper

(Cu) substrate for the thin-GaN light-emitting diodes

(LEDs) without barriers by the selective electroplating technique

in this study. The contours of the Cu bumps with different

current density were measured, and we observed that the

average thickness decreases with reinforcement of the current

density. The current density under the condition between 40

and 80 mA/cm

was proved to possess the best morphology in

our experiments.

Speaker Biography

Szu Han Chao is a PhD student in the department of Chemical and Materials Engineering

at Tamkang University, Taiwan. Her major research interests are Raman, Light-emitting

diodes and Optical simulation. This presentation is part of collaboration with her Professor

Shih Chieh Hsu. He has completed his PhD at the age of 30 years from National Central

University and postdoctoral studies from Research Center for Applied Sciences, Academia

Sinica. He is the associate professor (2015-present), Department of Chemical andMaterials

Engineering, Tamkang University, Taiwan. He has publishedmore than 20 papers in reputed

journals and has been serving as an editorial board member of repute.