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July 23-25, 2018 | Moscow, Russia
Materials Science and Engineering
International Conference on
Journal of Materials Science and Nanotechnology | Volume 2
With a density of integration continuously increasing,
driven by a need of an always growing power efficiency
and performance, 3D integration represent today the most
promising strategy to adopt for next generation packaging.
Although, various designs are considered, whatever the
proposed technology, all of them share the same need to find
critical defects (to be correlated with failure events) or to verify
the compliance of structural elements in the bulk. X-rays are a
powerful tool for this kind of analysis, in particular because they
allow a non-destructive approach. 3D characterisation of the
device can be obtained, whilst keeping the device functionality,
enabling multimodal characterisation and in-situ/in-operando
analysis. However, today, the instruments delivering 3D X-ray
imaging (“computed tomography”) available for conventional
laboratory purposes, offer a too poor resolution, compared
to the needs of nano-electronics. Thanks to the power of
synchrotron radiation, this limit can be now overcome. This talk
will illustrate the opportunities offered by synchrotron X-ray
3D imaging operated at the European Synchrotron in Grenoble
(France) in collaboration with CEA-LETI. We will describe the
unmatched characterisation opportunity offered by the new
generation nano-tomography instruments on some standard
3DIC components. This presentation will demonstrate the
power of this novel investigation tool, and their importance
to boost the packaging innovation. Moreover, we will describe
the complementarity between synchrotron X-ray 3D imaging
and other traditional nano-characterisation techniques, to
offer a multi-modal/multi-scale/multi-technique approach to
the future challenges of characterisation in micro and nano-
electronics.
Speaker Biography
Ennio Capria is actually Deputy Head of Business Development (Experiment Division)
of the European Synchrotron (ESRF). He gained his PhD in Applied Physics at Cranfield
University (UK). He then undertook a series of academic and industrial positions in
different sectors of nanotechnology. In his research career he has worked on the
development of nanobiosensors and on nanocomposites for various applications. In
2011 he joined Elettra where he worked on manufacturing of optoelectronic devices
and particularly their characterisation with synchrotron light. Finally, from September
2013 he joined ESRF as the IRT NanoElec Industrial Liaison Engineer, dedicated to the
domain of micro-electronics. He has a strong background in the application of a wide
range of synchrotron techniques to industrial and applied R&D problems.
e:
Ennio Capria
European Synchrotron, France
Non-Destructive high resolution 3D imaging for Nanoelectronics