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April 15-16, 2019 | Frankfurt, Germany
Applied Physics & Laser, Optics and Photonics
International Conference on
Page 19
Materials Science and Nanotechnology | Volume: 3
E
urope is at the threshold of a technological
revolution - the application of the power of light
to solve our greatest global challenges. As a fast,
compact, energy efficient and therefore sustainable
option, photonic integrated chips (PIC’s) have
been developed initially to solve challenges in the
power consumption and speed requirements for
telecommunications and datacenters. However, it
is expected that will tap into world markets like 5G,
military, medical, sensors for strain, and gas detection
and LIDAR. Volume manufacturing of PIC’s is rapidly
becoming widespread available through foundries
that have evolving process design kits with more
extensive building blocks in their libraries. Success
depends on the possibility of assembling the chips in
large quantities for the various markets. Up to now
these have all been labor-intensive production steps,
the high cost of which has posed a barrier to large-
scale introduction.
The keynote will address topics like: State of the
art in the packaging field, automation assembly
requirements, cost drivers, why hybrid integration is
sometimes inevitable, do’s anddont'swhendesigning
chips for assembly.
Speaker Biography
Jeroen Duis received his bachelor’s degree from the Technical
University of Rijswijk in 2001. After his study he worked 16 years within
TE Connectivity. Within the fiber optic business unit and corporate
technology team he held several positions in engineering, research,
technology scouting and management. During this time, he gained a
broad experience in laser processing of glass fibers, WDM multiplexing,
low loss optical interconnects, next generation photonic chip packaging
for applications in mobile phones, automotive and high-speed computing
applications. In March 2017, he accepted a position at SMART Photonics,
a scale up in Indium Phosphide wafer manufacturing where he was
responsible for the business development. November 2018, he accepted
a position as chief commercial officer at PHIX Photonics Assembly where
he is responsible for the commercial activities and the strategic direction
for the hybrid packaging. He is the author and co-author of several
publications and holds 15 patent applications in the field of optical
interconnection technology.
e:
j.duis@phix.comJeroen Duis
PHIX Photonics Assembly, The Netherlands
Packaging of photonic ICs